Please use this identifier to cite or link to this item: https://www.um.edu.mt/library/oar/handle/123456789/106550
Title: Method for producing czochralski silicon free of agglomerated self-interstitial defects : U. S. Patent No. 6,635,587 B1
Authors: Mule’ Stagno, Luciano
Libbert, Jeffrey L.
Holzer, Joseph C.
Keywords: Semiconductor wafers
Silicon
Metals -- Heat treatment
Issue Date: 2003
Publisher: United States Patent and Trademark Office
Citation: Mule' Stagno, L., Libbert, J. L., & Holzer, J. C. (2003). Method for producing czochralski silicon free of agglomerated self-interstitial defects. (U. S. Patent No. 6,635,587 B1). United States.
Abstract: A process for heat treating a Silicon wafer to dissolve B-type agglomerated interstitial defects present therein. The process includes heating the Silicon wafer at a temperature for a time sufficient to dissolve B-defects, the wafer being heated to Said temperature at a rate Sufficient to prevent B-defects from becoming Stabilized Such that these defects are rendered incapable of being dissolved.
URI: https://www.um.edu.mt/library/oar/handle/123456789/106550
Appears in Collections:Scholarly Works - InsSE



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