Thick layer carbon nanofibre copper matrix composites for thermally loaded applications

Abstract

Carbon nanofibres and carbon nanotubes have been the focus of considerable research since their first observation. The physical and mechanical properties reported far exceed those of any current material available. In particular the unique combined thermal properties of carbon nanotubes offer scope for development in a metal matrix as heat spreaders for the electronics industry. In the electronics field, the issue of shrinking dimensions warrants the use of highly reliable heat dissipaters. Metal Matrix Composites with nano carbon inclusions are potential candidates to remove the heat generated in semiconductors which would otherwise impair the reliability of such devices. This research aims to study the properties of a copper-carbon fibre composite in thick film applications in the region of 100-500um or bulk material, with the main interest to thermal conductivity and coefficient of thermal expansion.